Chip-On-Board LED Technology

A much higher packing density

Chip-on-Board LED technology describes the mounting of a bare LED chip in direct contact with the substrate to produce LED arrays. It is a method of LED packaging which has a number of advantages over traditional surface mount technologies such as the use of “T-pack” and Surface mount LEDs.

Due to the small size of the LED chip, Chip-on-Board technology allows for a much higher packing density than surface mount technology. This results in higher intensity & greater uniformity for the user.

chip on board led technology

The figure below illustrates the differences in the number of LEDs that can be placed on a 10X10mm square and the resulting power output of the array.


chip on board leds

 

As you can see, by using Chip-On-Board (COB) technology, the number of LEDs is 38 times higher than T-Pack technology and 8.5 times higher than surface mount technology, improving the brightness significantly.

ProPhotonix works with customers in diverse industries to design and produce custom chip-on-board LED solutions from LED arrays to complete turnkey solutions.

 

The advantages of Chip-on-Board LED arrays include:

  • Compactness due to small size of chip
  • High-Intensity, particularly at close distance
  • High-Uniformity, even at close working distances
  • Superior Thermal Performance for better lifetime, stability and reliability

 

 

Need help to optimize for your application?

For comprehensive technical support. Talk to us.

Contact UsContact Us

Bernhard Russell

Inside Sales

Andrea Gregorio

Inside Sales

 
 

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